添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制

孙利星, 薛航宇, 梁淑华, 杨倩, 姜琪, 邹军涛

Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer

SUN Lixing, XUE Hangyu, LIANG Shuhua, YANG Qian, JIANG Qi, ZOU Juntao

表1 连接温度为850和875 ℃时，QAl10-5-5合金/Ag箔/TC6合金双金属界面过渡层EDS点扫描结果 (atomic fraction / %)

Table 1 EDS results of interfacial layers of QAl10-5-5/Ag foil/TC6 bimetals at the bonding temperatures of 850 and 875 oC (See in Figs.4c and d)

Point Cu Ti Ag Al Mo Fe Ni 1 2.16 0.41 91.96 3.31 1.89 0.27 - 2 53.66 29.56 - 16.78 - - - 3 31.23 14.94 26.11 14.65 - 5.65 7.42