添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制
Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer
添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制 |
| 孙利星, 薛航宇, 梁淑华, 杨倩, 姜琪, 邹军涛 |
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Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer |
| SUN Lixing, XUE Hangyu, LIANG Shuhua, YANG Qian, JIANG Qi, ZOU Juntao |
| 图10 连接温度为805 ℃时，电沉积Ag层QAl10-5-5合金/TC6双金属界面过渡层的TEM明场像，及α-Ti/Ti3Al相界面的HRTEM像和快速Fourier变换 |
| Fig.10 TEM bright field image of Ag layer deposited QAl10-5-5/ TC6 bimetal interface (a) and HRTEM image (b) and fast Fourier transform (c) of α-Ti/Ti3Al phase boundary at the bonding temperature of 805 oC (d—interplanar spacing) |
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