添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制
Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer
添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制 |
| 孙利星, 薛航宇, 梁淑华, 杨倩, 姜琪, 邹军涛 |
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Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer |
| SUN Lixing, XUE Hangyu, LIANG Shuhua, YANG Qian, JIANG Qi, ZOU Juntao |
| 图9 连接温度为805 ℃时，电沉积Ag层QAl10-5-5合金/TC6合金双金属界面过渡层TC6合金侧的TEM-HAADF像、EDS元素面分布图和SAED花样 |
| Fig.9 Interfacial TEM-HAADF image (a); EDS element distribution maps of Cu, Ti, and Al (b-d); and SAED patterns of the corresponding regions in Fig.9a (e-h) of Ag layer deposited QAl10-5-5/TC6 bimetal at the bonding temperature of 805 oC |
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