添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制
Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer
添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制 |
| 孙利星, 薛航宇, 梁淑华, 杨倩, 姜琪, 邹军涛 |
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Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer |
| SUN Lixing, XUE Hangyu, LIANG Shuhua, YANG Qian, JIANG Qi, ZOU Juntao |
| 图7 不同连接温度下电沉积Ag层QAl10-5-5合金/TC6合金双金属界面断口形貌 |
| Fig.7 Fracture morphologies at bonding temperatures of 805 oC (a), 835 oC (b), and 850 oC (c) of Ag layer deposited QAl10-5-5/TC6 bimetals |
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