添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制

孙利星, 薛航宇, 梁淑华, 杨倩, 姜琪, 邹军涛

Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer

SUN Lixing, XUE Hangyu, LIANG Shuhua, YANG Qian, JIANG Qi, ZOU Juntao

图5 不同电沉积工艺下，电沉积Ag层QAl10-5-5合金横截面显微组织的SEM像和样品的宏观形貌，及电沉积电流强度0.5 A、电沉积时间25 min下电沉积Ag层QAl10-5-5合金横截面的反极图

Fig.5 Cross-sectional SEM images and macromorphologies (insets) of QAl10-5-5 alloy deposited with Ag layer under different electrodeposition process parameters (a-h), and IPF of the cross-section of QAl10-5-5 alloy deposited with Ag layer under 0.5 A for 25 min (i) (a-e) under current of 0.1 A for 5 min (a), 10 min (b), 15 min (c), 20 min (d), and 25 min (e) (f-h) under currents of 0.3 A (f), 0.5 A (g), and 0.7 A (h) for 25 min