添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制

孙利星, 薛航宇, 梁淑华, 杨倩, 姜琪, 邹军涛

Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer

SUN Lixing, XUE Hangyu, LIANG Shuhua, YANG Qian, JIANG Qi, ZOU Juntao

图4 不同工艺条件下，QAl10-5-5合金/TC6合金直接连接双金属界面及QAl10-5-5合金/Ag箔/TC6合金双金属界面组织形貌的SEM像和剪切强度 (a) QAl10-5-5/TC6 bimetal at a bonding temperature of 850 oC (b-d) QAl10-5-5/Ag foil/TC6 bimetal at bonding temperatures of 825 oC (b), 850 oC (c), and 875 oC (d)

Fig.4 SEM images showing interfacial morphologies (a-d) and shear strengths (e) of bimetals at different bonding conditions