添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制
Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer
添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制 |
| 孙利星, 薛航宇, 梁淑华, 杨倩, 姜琪, 邹军涛 |
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Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer |
| SUN Lixing, XUE Hangyu, LIANG Shuhua, YANG Qian, JIANG Qi, ZOU Juntao |
| 图2 QAl10-5-5合金表面电沉积Ag层制备流程示意图 |
| Fig.2 Schematics of the preparation of QAl10-5-5 alloy deposited with Ag layer (E—potential; |
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