累积叠轧焊Cu/Nb多层材料中的滑移传递

杨然, 宋韶杰, 刘飞龙, 申熙美, 宋克兴, 刘峰

Slip Transfer in Accumulative Roll Bonding Cu/Nb Multilayer Composites

YANG Ran, SONG Shaojie, LIU Feilong, SHEN Ximei, SONG Kexing, LIU Feng

表2 Cu层中GB2处两晶粒激活滑移系的Schmid因子及两滑移系间的滑移传递参数

Table 2 Schmid factors of activated slip systems and slip transfer criteria between the two slip systems at GB2 in Cu layer (see in Fig.7)

Slip system m m' Δb SS8 in grain 7 0.45 0.27 1.000 SS9 in grain 31 0.45