累积叠轧焊Cu/Nb多层材料中的滑移传递
杨然, 宋韶杰, 刘飞龙, 申熙美, 宋克兴, 刘峰

Slip Transfer in Accumulative Roll Bonding Cu/Nb Multilayer Composites
YANG Ran, SONG Shaojie, LIU Feilong, SHEN Ximei, SONG Kexing, LIU Feng
表1 Cu层中GB1处两晶粒激活滑移系的Schmid因子和滑移传递参数
Table 1 Schmid factors (m) and slip transfer criteria for activated slip systems of two grains at GB1 in Cu layer
Slip systemm'/Δb

SS2 in grain 9

(m = 0.42)

SS9 in grain 9

(m = 0.48)

SS1 in grain 2

(m = 0.36)

0.27/1.0000.77/0.005

SS11 in grain 2

(m = 0.28)

0.78/0.0100.28/0.996