累积叠轧焊Cu/Nb多层材料中的滑移传递
Slip Transfer in Accumulative Roll Bonding Cu/Nb Multilayer Composites
(a) 0% (b) 4% (c) 8% (d) 12%
累积叠轧焊Cu/Nb多层材料中的滑移传递 |
| 杨然, 宋韶杰, 刘飞龙, 申熙美, 宋克兴, 刘峰 |
|
Slip Transfer in Accumulative Roll Bonding Cu/Nb Multilayer Composites |
| YANG Ran, SONG Shaojie, LIU Feilong, SHEN Ximei, SONG Kexing, LIU Feng |
| 图6 不同应变下Cu层中晶粒2与9间晶界(GB1)处的激活滑移系 (a) 0% (b) 4% (c) 8% (d) 12% |
| Fig.6 Activated slip systems at GB1 between grains 2 and 9 in Cu layer under different ε (GB—grain boundary) |
|
|