累积叠轧焊Cu/Nb多层材料中的滑移传递

杨然, 宋韶杰, 刘飞龙, 申熙美, 宋克兴, 刘峰

Slip Transfer in Accumulative Roll Bonding Cu/Nb Multilayer Composites

YANG Ran, SONG Shaojie, LIU Feilong, SHEN Ximei, SONG Kexing, LIU Feng

图4 应变为12%时Cu层中晶粒9的实际滑移迹和所有理论滑移迹

Fig.4 Actual slip traces (a) and all theoretical slip traces (b) in grain 9 of Cu layer under 12% strain (SS represents slip system. The lines in Fig.4b with different colors represent different sets of slip planes, the rightmost value in the legend of Fig.4b represents the Schmid factor of each slip system, the same in Fig.5)