累积叠轧焊Cu/Nb多层材料中的滑移传递

杨然, 宋韶杰, 刘飞龙, 申熙美, 宋克兴, 刘峰

Slip Transfer in Accumulative Roll Bonding Cu/Nb Multilayer Composites

YANG Ran, SONG Shaojie, LIU Feilong, SHEN Ximei, SONG Kexing, LIU Feng

图3 未变形样品ROI的反极图(IPF)和最大Schmid因子对应的滑移迹

Fig.3 Inverse pole figure (IPF) of the ROI (Numbers represent grain identification, the same below) (a) and the slip trace corresponding to the maximum Schmid factor of the underformed sample (Red lines represent Cu layers, blue lines represent Nb layers) (b)