超声功率对W90/Sn/Mg接头微观组织和力学性能的影响

张旭东, 付伟, 宋晓国, 宋娜, 孙浩, 胡胜鹏

Effect of Ultrasonic Power on the Microstructure and Mechanical Property of W90/Sn/Mg Joint

ZHANG Xudong, FU Wei, SONG Xiaoguo, SONG Na, SUN Hao, HU Shengpeng

图2 100 W超声功率下W90/Sn/Mg接头横截面微观组织的SEM像及EDS分析 (a) typical interface microstructure (b-f) EDS mappings of W (b), Ni (c), Fe (d), Sn (e), and Mg (f) (g, h) EDS line scanning results along lines ab (b) and cd (c) in Fig.2a

Fig.2 Cross-sectional SEM image (a) and EDS results (b-h) of the W90/Sn/Mg joint under an ultrasonic power of 100 W