熔盐堆用镍基合金失效机理与改性策略研究进展
王优, 陈向阳, 王煦嘉, 汤春桃, 沈朝, 曾小勤

Progress in Failure Mechanisms and Modification Strategies of Nickel-Based Alloys for Molten Salt Reactors
WANG You, CHEN Xiangyang, WANG Xujia, TANG Chuntao, SHEN Zhao, ZENG Xiaoqin
表5 常见涂层体系、制备工艺及主要工艺特点与适用条件[71~75]
Table 5 Summary of typical coating systems, preparation processes, main process features, and applicable conditions[71-75]
Typical coating material systemCoating preparation methodMain process feature and applicable condition
Cr, Cr-Zr, Cr-Nb, Cr-AlPhysical vapor deposition (PVD)Forms dense and uniform coatings with controllable thickness; suitable for complex geometries; limited deposition rate; coating adhesion depends on substrate pretreatment
Cr, Cr-Al, Cr-Ni, Cr-FeHigh power impulse magnetron sputtering (HiPIMS)Produces dense, defect-free coatings with high ionization of sputtered species; excellent adhesion and microstructure uniformity; suitable for oxidation- and corrosion-resistant coatings on structural materials

Cr3C2, SiC, TiN

Chemical vapor deposition (CVD)Enables good conformal coverage and high coating purity; applicable for diffusion barriers and high-temperature environments; requires high deposition temperature (700-1000 oC)

Ni, Ni-W, Ni-Mo

Electroplating/electrochemical depositionLow-cost and scalable process; capable of producing uniform metallic coatings; limited by substrate conductivity and coating compactness; post-deposition annealing improves adhesion
Ni, Ni-Cr, Ni-Al, Fe-Cr-AlCold spraySolid-state deposition with minimal oxidation; produces thick coatings with high bonding strength; suitable for large components and localized repair
Ni-Cr, Ni-Cr-Al, Ni-MoLaser cladding/surface meltingAchieves metallurgical bonding with substrate and gradient composition transition; effective for high-temperature oxidation protection; potential thermal stress and dilution at interface

Al2O3, SiO2, Y2O3

Sol-gel/dip coating

Simple and cost-effective; applicable to complex geometries; suitable for oxide protective films; poor adhesion under thermal cycling unless combined with interlayer