热压温度对TC4合金扩散连接区组织与性能的影响
Effect of Hot-Pressing Temperature on the Microstructure and Properties of the Diffusion-Bonded Region of TC4 Alloy
(a) sample 1# (930 oC) (b) sample 2# (950 oC) (c) sample 3# (970 oC)
热压温度对TC4合金扩散连接区组织与性能的影响 |
| 张洺川, 徐勤思, 刘意, 蔡雨升, 牟义强, 任德春, 吉海宾, 雷家峰 |
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Effect of Hot-Pressing Temperature on the Microstructure and Properties of the Diffusion-Bonded Region of TC4 Alloy |
| ZHANG Mingchuan, XU Qinsi, LIU Yi, CAI Yusheng, MU Yiqiang, REN Dechun, JI Haibin, LEI Jiafeng |
| 图3 不同热压温度下扩散连接接头显微组织的SEM像 |
| Fig.3 SEM images of microstructures of joints diffusion bonded at different temperatures (DRX—dynamic recrystallization) (a) sample 1# (930 oC) (b) sample 2# (950 oC) (c) sample 3# (970 oC) |
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