集成电路芯片锡基微凸点电迁移：从物理本质到可靠性提升

黄明亮, 王胜博, 尤海潮, 刘厚麟, 任婧, 黄斐斐

Electromigration of Sn-Based Microbumps in Chip Interconnections of Integrated Circuits: From Physical Nature to Reliability Improvement

HUANG Mingliang, WANG Shengbo, YOU Haichao, LIU Houlin, REN Jing, HUANG Feifei

图8 凸点下金属化层(UBM)组合方式对微焊点电迁移可靠性的影响[88]

Fig.8 Effect of UBM combination on EM reliability of solder bumps[88] (UBM—under bump metallization, OSP—organic solderability preservative, ENEPIG—electroless nickel electroless palladium immersion gold) (a) Ni/SAC305/OSP (b) Ni/SAC305/ENEPIG