集成电路芯片锡基微凸点电迁移：从物理本质到可靠性提升

黄明亮, 王胜博, 尤海潮, 刘厚麟, 任婧, 黄斐斐

Electromigration of Sn-Based Microbumps in Chip Interconnections of Integrated Circuits: From Physical Nature to Reliability Improvement

HUANG Mingliang, WANG Shengbo, YOU Haichao, LIU Houlin, REN Jing, HUANG Feifei

图6 同步辐射技术原位实时表征Sn-58%Bi钎料焊点液-固电迁移中Bi原子的定向迁移[18]

Fig.6 In situ observations of migration behavior of Bi atoms during liquid-solid electromigration (L-S EM) for the Cu/Sn-58%Bi/Cu interconnect using synchrotron radiation real-time imaging technology (a-t)[18]