集成电路芯片锡基微凸点电迁移：从物理本质到可靠性提升

黄明亮, 王胜博, 尤海潮, 刘厚麟, 任婧, 黄斐斐

Electromigration of Sn-Based Microbumps in Chip Interconnections of Integrated Circuits: From Physical Nature to Reliability Improvement

HUANG Mingliang, WANG Shengbo, YOU Haichao, LIU Houlin, REN Jing, HUANG Feifei

图5 同步辐射技术原位实时表征Cu/Sn-9%Zn/Cu微焊点液-固电迁移中发生的反极性效应[14]

Fig.5 In situ observations of reverse polarity effect during liquid-solid electromigration for the Cu/Sn-9%Zn/Cu interconnect using synchrotron radiation real-time imaging technology (a-i)[14]