集成电路芯片锡基微凸点电迁移：从物理本质到可靠性提升

黄明亮, 王胜博, 尤海潮, 刘厚麟, 任婧, 黄斐斐

Electromigration of Sn-Based Microbumps in Chip Interconnections of Integrated Circuits: From Physical Nature to Reliability Improvement

HUANG Mingliang, WANG Shengbo, YOU Haichao, LIU Houlin, REN Jing, HUANG Feifei

图4 电迁移导致的微焊点微观组织演变：阴极侧裂纹[37]和阳极侧“小丘”[22]

Fig.4 EM-induced microstructural evolution of microbumps (a) crack at the cathode[37] (b) hillocks at the anode[22]