集成电路芯片锡基微凸点电迁移：从物理本质到可靠性提升

黄明亮, 王胜博, 尤海潮, 刘厚麟, 任婧, 黄斐斐

Electromigration of Sn-Based Microbumps in Chip Interconnections of Integrated Circuits: From Physical Nature to Reliability Improvement

HUANG Mingliang, WANG Shengbo, YOU Haichao, LIU Houlin, REN Jing, HUANG Feifei

图1 β-Sn晶粒的各向异性对微焊点电迁移失效模式的影响[22]

Fig.1 Effect of anisotropy of β-Sn grains on electromigration (EM)-induced failure of microbumps[22] (PCB—printed circuit board, RD—rolling direction) (a) cross-sectional images of the solder bumps (b) the corresponding EBSD maps in RD (Numbers show the β-Sn grain numbers; insets show the β-Sn grain orient-ations and the corlorkey of β-Sn grains; the same in Figs.2 and 3)