(111)取向纳米孪晶Cu的抗氧化性能及焊料润湿性 |
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许增光, 周士祺, 李晓, 刘志权 | ||||||||||||
Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu |
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XU Zengguang, ZHOU Shiqi, LI Xiao, LIU Zhiquan | ||||||||||||
表1 250℃不同氧化时间下焊料在(111)nt-Cu和C-Cu样品表面的铺展面积 (mm2) |
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Table 1 Spreading areas of the solder bump on the surfaces of (111)nt-Cu and C-Cu samples oxidized at 250oC for different time |
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