(111)取向纳米孪晶Cu的抗氧化性能及焊料润湿性
许增光, 周士祺, 李晓, 刘志权

Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu
XU Zengguang, ZHOU Shiqi, LI Xiao, LIU Zhiquan
表1 250℃不同氧化时间下焊料在(111)nt-Cu和C-Cu样品表面的铺展面积 (mm2)
Table 1 Spreading areas of the solder bump on the surfaces of (111)nt-Cu and C-Cu samples oxidized at 250oC for different time
Sample0 min3 min12 min
(111)nt-Cu2.6392.2761.896
C-Cu2.1322.0151.522