(111)取向纳米孪晶Cu的抗氧化性能及焊料润湿性
Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu
(111)取向纳米孪晶Cu的抗氧化性能及焊料润湿性 |
| 许增光, 周士祺, 李晓, 刘志权 |
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Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu |
| XU Zengguang, ZHOU Shiqi, LI Xiao, LIU Zhiquan |
| 图10 氧化前(111)nt-Cu和C-Cu样品截面的FIB像以及Cu在晶界处扩散的示意图 |
| Fig.10 Cross section FIB images of electroplated (111)nt-Cu (a) and C-Cu (b) samples; diffution illustrations of Cu atom on grain boundaries in (111)nt-Cu (c) and C-Cu (d) samples (JCu1—Cu diffusion flux in (111)nt-Cu along the grain boundary; JCu2—Cu diffusion flux in C-Cu along the grain bounadry) |
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