(111)取向纳米孪晶Cu的抗氧化性能及焊料润湿性
Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu
(111)取向纳米孪晶Cu的抗氧化性能及焊料润湿性 |
| 许增光, 周士祺, 李晓, 刘志权 |
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Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu |
| XU Zengguang, ZHOU Shiqi, LI Xiao, LIU Zhiquan |
| 图7 250℃不同氧化时间下焊料在(111)nt-Cu和C-Cu样品表面的铺展面积云图 |
| Fig.7 Spreading cloud images of the solder bump on the surfaces of (111)nt-Cu (a-c) and C-Cu (d-f) samples oxidized at 250oC for 0 min (a, d), 3 min (b, e), and 12 min (c, f) |
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