基于熔池原位冶金的电弧增材制造Al-Cu-Li合金显微组织与硬度

黎康杰, 孙泽羽, 何蓓, 田象军

Microstructure and Hardness of Al-Cu-Li Alloy Fabricated by Arc Additive Manufacturing Based on In Situ Metallurgy of Molten Pool

LI Kangjie, SUN Zeyu, HE Bei, TIAN Xiangjun

表1 2219铝合金焊丝和沉积基材的化学成分 (mass fraction / %)

Table 1 Chemical compositions of 2219 wire and substrate

Material Cu Mg Mn V Ti Zr Zn Fe Si Al 2219 5.8-6.8 0.2-0.4 0.2-0.4 0.05-0.15 0.1-0.2 0.10-0.25 ≤ 0.1 ≤ 0.3 ≤ 0.2 Bal. Substrate 6.2 0.04 0.4 0.05 0.3 0.2 ≤ 0.1 0.3 0.2 Bal.