多场耦合侵蚀下环保Ag/Ti2SnC复合电接触材料的微/纳米力学行为及微结构演变
Micro/Nano-Mechanical Behavior and Microstructure Evolution of Eco-Friendly Ag/Ti2SnC Composite Electrical Contacts Under Multi-Field Coupled Erosion
多场耦合侵蚀下环保Ag/Ti2SnC复合电接触材料的微/纳米力学行为及微结构演变 |
| 丁宽宽, 丁健翔, 张凯歌, 白忠臣, 张培根, 孙正明 |
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Micro/Nano-Mechanical Behavior and Microstructure Evolution of Eco-Friendly Ag/Ti2SnC Composite Electrical Contacts Under Multi-Field Coupled Erosion |
| DING Kuankuan, DING Jianxiang, ZHANG Kaige, BAI Zhongchen, ZHANG Peigen, SUN Zhengming |
| 图13 Ag/10%Ti2SnC复合材料在电弧放电条件下电压场分布、温度场分布、等温线和热膨胀位移的稳态模拟 |
| Fig.13 Steady-state simulations of voltage field distribution (a), temperature field distribution (b), isotherm (c), and thermal expansion displacement (d) of Ag/10%Ti2SnC contacts under electrical arc discharging |
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