多场耦合侵蚀下环保Ag/Ti2SnC复合电接触材料的微/纳米力学行为及微结构演变
Micro/Nano-Mechanical Behavior and Microstructure Evolution of Eco-Friendly Ag/Ti2SnC Composite Electrical Contacts Under Multi-Field Coupled Erosion
多场耦合侵蚀下环保Ag/Ti2SnC复合电接触材料的微/纳米力学行为及微结构演变 |
| 丁宽宽, 丁健翔, 张凯歌, 白忠臣, 张培根, 孙正明 |
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Micro/Nano-Mechanical Behavior and Microstructure Evolution of Eco-Friendly Ag/Ti2SnC Composite Electrical Contacts Under Multi-Field Coupled Erosion |
| DING Kuankuan, DING Jianxiang, ZHANG Kaige, BAI Zhongchen, ZHANG Peigen, SUN Zhengming |
| 图8 电弧侵蚀后Ag/x%Ti2SnC电触头区域α和区域β的蠕变曲线 |
| Fig.8 Creep curves of area α (red lines) and area β (blue lines) in Ag/x%Ti2SnC contact with x = 10 (a), x = 12 (b), and x = 15 (c) after arc erosion (Δh—displacement, t—hold time) |
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