多场耦合侵蚀下环保Ag/Ti2SnC复合电接触材料的微/纳米力学行为及微结构演变
Micro/Nano-Mechanical Behavior and Microstructure Evolution of Eco-Friendly Ag/Ti2SnC Composite Electrical Contacts Under Multi-Field Coupled Erosion
多场耦合侵蚀下环保Ag/Ti2SnC复合电接触材料的微/纳米力学行为及微结构演变 |
| 丁宽宽, 丁健翔, 张凯歌, 白忠臣, 张培根, 孙正明 |
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Micro/Nano-Mechanical Behavior and Microstructure Evolution of Eco-Friendly Ag/Ti2SnC Composite Electrical Contacts Under Multi-Field Coupled Erosion |
| DING Kuankuan, DING Jianxiang, ZHANG Kaige, BAI Zhongchen, ZHANG Peigen, SUN Zhengming |
| 图7 电弧侵蚀后Ag/x%Ti2SnC电触头的纳米硬度、模量、界面纳米硬度和界面模量 |
| Fig.7 Nano-hardnesses (a), moduli (b), interface nano-hardnesses (c), and interface moduli (d) of Ag/x%Ti2SnC contacts after arc erosion (ΔH—nano-hardness difference in area α and area β, ΔE—modulus difference in area α and area β) |
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