微电子互连用锡基合金及复合钎料热-机械可靠性研究进展

郭福, 杜逸晖, 籍晓亮, 王乙舒

Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection

GUO Fu, DU Yihui, JI Xiaoliang, WANG Yishu

表1 金属修饰非金属增强相在钎料中发生团聚现象导致性能降低对应的添加量[30,72,73,80~96]

Table 1 Addition amount corresponding to properties deterioration caused by metal modified non-metallic reinforcement agglomeration[30,72,73,80-96]

Type of reinforcement Solder alloy (mass fraction / %) ω (mass fraction / %) Ref. Ni-GNSs Sn-2.5Ag-0.7Cu > 0.05 [81] Sn-CNTs Sn-58Bi > 0.1 [82,83] Cu-CNFs Sn-3.5Ag > 0.05 [84] Ni-CNTs Sn-3.5Ag-0.7Cu > 0.05 [85,86] Ni-CNTs Sn-3.5Ag-0.7Cu 0.2 [73] Ni-CNTs SAC305 > 0.05 [87] Ni-CNTs Sn-58Bi > 0.05 [88] Ni-CNTs Sn-58Bi 0.2 [89,90] Ni-CNTs Sn-0.7Cu > 0.075 [91] Ni-CNTs Sn-57.6Bi-0.4Ag > 0.07 [72] Ag-CNTs SAC305 0.1 [92] Ag-CNTs Sn-58Bi > 0.05 [80] Ag-CNTs Sn-58Bi > 0.1 [93-95] Ag-GNSs SAC305 > 0.05 [30,96]