微电子互连用锡基合金及复合钎料热-机械可靠性研究进展
Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection
微电子互连用锡基合金及复合钎料热-机械可靠性研究进展 |
| 郭福, 杜逸晖, 籍晓亮, 王乙舒 |
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Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection |
| GUO Fu, DU Yihui, JI Xiaoliang, WANG Yishu |
| 图7 时效处理840 h后SAC0307-0.06Pr/Cu和SAC0307-0.06Pr-0.06Al2O3/Cu焊点断裂路径示意图[ |
| Fig.7 Schematic of the fracture pathway for SAC0307-0.06Pr/Cu and SAC0307-0.06Pr-0.06Al2O3/Cu solder joint after aging treatment for 840 h[ |
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