微电子互连用锡基合金及复合钎料热-机械可靠性研究进展
Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection
(a) SAC0307 (b) SAC0307-Al2O3 (c) SAC0307-Pr (d) SAC0307-Pr-Al2O3
微电子互连用锡基合金及复合钎料热-机械可靠性研究进展 |
| 郭福, 杜逸晖, 籍晓亮, 王乙舒 |
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Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection |
| GUO Fu, DU Yihui, JI Xiaoliang, WANG Yishu |
| 图6 Al2O3纳米颗粒和游离Pr原子对金属间化合物(IMCs)作用示意图[ (a) SAC0307 (b) SAC0307-Al2O3 (c) SAC0307-Pr (d) SAC0307-Pr-Al2O3 |
| Fig.6 Illustrations of intermetallic compounds (IMCs) growth in solder matrix during thermal cycling[ |
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