微电子互连用锡基合金及复合钎料热-机械可靠性研究进展
Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection
微电子互连用锡基合金及复合钎料热-机械可靠性研究进展 |
| 郭福, 杜逸晖, 籍晓亮, 王乙舒 |
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Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection |
| GUO Fu, DU Yihui, JI Xiaoliang, WANG Yishu |
| 图1 团聚在SAC0307-0.3CeO2钎料表面的CeO2纳米颗粒[ |
| Fig.1 CeO2 nanoparticles on the surface of an SAC0307-0.3CeO2 solder matrix[ |
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