基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制

王寒玉, 李彩, 赵璨, 曾涛, 王祖敏, 黄远

Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism

WANG Hanyu, LI Cai, ZHAO Can, ZENG Tao, WANG Zumin, HUANG Yuan

图11 分子动力学模拟所获W和Cu在不同温度下直接合金化时W/Cu界面及其附近的精细密度分布函数

Fig.11 Fine-scale density profiles (ρ(Z)) for W and Cu near and at the W/Cu interface constructed through direct alloying at different temperatures