基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制

王寒玉, 李彩, 赵璨, 曾涛, 王祖敏, 黄远

Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism

WANG Hanyu, LI Cai, ZHAO Can, ZENG Tao, WANG Zumin, HUANG Yuan

图8 纳米多孔化前后W板表面以及Cu电沉积层的XRD谱

Fig.8 XRD spectra of W without nanopores (a), nanoporous W (b), and Cu plating layer (c)