基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制
Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism
基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制 |
| 王寒玉, 李彩, 赵璨, 曾涛, 王祖敏, 黄远 |
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Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism |
| WANG Hanyu, LI Cai, ZHAO Can, ZENG Tao, WANG Zumin, HUANG Yuan |
| 图7 W/Cu层状复合材料剪切断口形貌(Cu侧)的SEM像以及EDS结果 |
| Fig.7 SEM image of shear fracture surface (Cu side) of the W/Cu layered composite (a), and EDS analysis result of the region marked with the rectangle in Fig.7a (b) |
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