基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制
Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism
基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制 |
| 王寒玉, 李彩, 赵璨, 曾涛, 王祖敏, 黄远 |
|
Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism |
| WANG Hanyu, LI Cai, ZHAO Can, ZENG Tao, WANG Zumin, HUANG Yuan |
| 图5 基于纳米活性结构制备的W/Cu层状复合材料的剪切强度测试应力-应变曲线 |
| Fig.5 Stress-strain curves of shear strength of W/Cu layered composites prepared based on nano active structure (a) and pretreated W block (b) |
|
|