基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制

王寒玉, 李彩, 赵璨, 曾涛, 王祖敏, 黄远

Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism

WANG Hanyu, LI Cai, ZHAO Can, ZENG Tao, WANG Zumin, HUANG Yuan

图4 W/Cu界面HRTEM像

Fig.4 HRTEM image of W/Cu interface (Inset I shows the fast Fourier transform (FFT) pattern from the darker area and inset II shows the brighter one, d—interplanar spacing)