基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制

王寒玉, 李彩, 赵璨, 曾涛, 王祖敏, 黄远

Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism

WANG Hanyu, LI Cai, ZHAO Can, ZENG Tao, WANG Zumin, HUANG Yuan

图3 W/Cu界面高角环形暗场(HAADF)像及元素分布图

Fig.3 High-angle annular dark field (HAADF) image of W/Cu interface (a), atomic fraction along the red arrow marked in Fig.3a (b), and elemental mappings of W (c) and Cu (d) Color online