基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制

王寒玉, 李彩, 赵璨, 曾涛, 王祖敏, 黄远

Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism

WANG Hanyu, LI Cai, ZHAO Can, ZENG Tao, WANG Zumin, HUANG Yuan

图2 表面纳米多孔化前后W板的线性伏安曲线

Fig.2 Linear sweep voltammetry (LSV) curves of the nanoporous W plate and the pretreated W plate (RHE—reversible hydrogen electrode)