基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制
Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism
基于纳米活性结构的不互溶W-Cu体系直接合金化及其热力学机制 |
| 王寒玉, 李彩, 赵璨, 曾涛, 王祖敏, 黄远 |
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Direct Alloying of Immiscible Tungsten and Copper Based on Nano Active Structure and Its Thermodynamic Mechanism |
| WANG Hanyu, LI Cai, ZHAO Can, ZENG Tao, WANG Zumin, HUANG Yuan |
| 图1 经过两步阳极氧化和H2退火还原W板的表面和截面形貌SEM像 |
| Fig.1 Surface SEM images and corresponding EDS results (insets) (a, c) and cross-section SEM images of W plate (b, d) with nanoporous structure layer prepared through two-step anodizing process without (a, b) and with (c, d) deoxidation process |
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