喷射成形过共晶AlSiCuMg合金的固溶行为
Solution Behavior of Spray-Formed Hypereutectic AlSiCuMg Alloy
(a, b) 475oC (c, d) 515oC (e, f) 535oC
喷射成形过共晶AlSiCuMg合金的固溶行为 |
| 冯迪, 朱田, 臧千昊, 李胤樹, 范曦, 张豪 |
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Solution Behavior of Spray-Formed Hypereutectic AlSiCuMg Alloy |
| FENG Di, ZHU Tian, ZANG Qianhao, LEE Yunsoo, FAN Xi, ZHANG Hao |
| 图7 不同固溶温度下合金微观组织的局部取向差(KAM)及二次电子像 |
| Fig.7 Local misoritations (a, c, e) and secondary electron images (b, d, f) of microstructures under different solution temperatures (The grain boundary colored by black indicate the misorientation larger than 15°. The grain boundary colored by red indicate the misorientation is in the range of 2°~15°. Solution time is 2 h) (a, b) 475oC (c, d) 515oC (e, f) 535oC |
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