无模板电沉积金属微纳米阵列材料研究进展

杭弢, 薛琦, 李明

A Review on Metal Micro-Nanostructured Array Materials Routed by Template-Free Electrodeposition

HANG Tao, XUE Qi, LI Ming

图10 微纳米阵列(纳米Ni针锥阵列预镀钯(Pd PPF)，微纳米Ni、Cu、Cu-Ni针锥阵列，单层石墨烯复合微纳米Cu针锥阵列，Au-Ni纳米针锥阵列)与封装树脂、镀锡帽铜柱、焊料、Au线键合示意图及键合界面SEM像^{[90~93,96,97]}

Fig.10 The bonding method and interface mechanism of micro-nanocone array
(a) schematic of nano-serrated palladium pre-plated frame (Pd PPF)^[90]
(b, c) SEM images of the interface between nanocones array Pd PPF and molding compound^[90] (EMC—epoxy molding compound)
(d, g, j, m) schematics of micro-nanocone array bonding and graphene coating micro-nanocone array with Sn-capped Cu bumps (d)^[91], soft solder (g, j)^[92,97], and Au wire (m)^[96]
(e, f, h, i, n) cross-section images of micro-nanocone array bonding with Sn-capped Cu bumps (e, f)^[91], Sn-3.0Ag-0.5Cu solder (h)^[92], Sn solder (i)^[93], and Au wire (n)^[96] (Inset in Fig.10i is the TEM image of the Ni-Sn bonding interface)
(k, l) aging behavior comparison between Sn-Cu and Sn-graphene-Cu bonds at 150^oC for 96 h^[97]