新型Ni-Co基高温合金塑性变形连接中界面组织演化及愈合机制

任少飞, 张健杨, 张新房, 孙明月, 徐斌, 崔传勇

Evolution of Interfacial Microstructure of Ni-Co Base Superalloy During Plastic Deformation Bonding and Its Bonding Mechanism

REN Shaofei, ZHANG Jianyang, ZHANG Xinfang, SUN Mingyue, XU Bin, CUI Chuanyong

图9 变形温度为1150℃，20%变形量下界面组织的TEM像

Fig.9 TEM images of bulging of interfacial grain boundaries (a) and interfacial substructure (b) at a deformation temperature of 1150℃ and 20% deformation