基于飞秒激光时域热反射法的微尺度Cu-Sn金属间化合物热导率研究

周丽君, 位松, 郭敬东, 孙方远, 王新伟, 唐大伟

Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System

ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei

表1 Cu6Sn5热导率拟合计算结果及误差统计 (W·m-1·K-1)

Table 1 Statistics of calculated results of thermal conductivity and corresponding error of Cu6Sn5

Item Raw data 4.2% (cp ) -2.1% (cp ) 1 nm (dAl) -1 nm (dAl) 1 μm (Dpump) -1 μm (Dpump) Error ±0.6% -4.0% 2.1% 1.5% -1.8% 0.4% -0.4% 1 47.0 45.1 48.0 47.7 46.3 47.2 46.8 2 47.7 45.8 48.7 48.4 46.9 47.8 47.5 3 47.5 45.7 48.5 48.2 46.8 47.7 47.4 Mean 47.4 45.5 48.4 48.1 46.7 47.6 47.2