基于飞秒激光时域热反射法的微尺度Cu-Sn金属间化合物热导率研究
Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System
基于飞秒激光时域热反射法的微尺度Cu-Sn金属间化合物热导率研究 |
| 周丽君, 位松, 郭敬东, 孙方远, 王新伟, 唐大伟 |
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Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System |
| ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei |
| 图6 Cu6Sn5和Cu3Sn热导率测量的相位与幅值信号实验数据与理论拟合曲线 |
| Fig.6 Experimental data of thermal conductivity measurement and the fitting curves of phase angle signal (a, b) and amplitude signal (c, d) for Cu6Sn5 (a, c) and Cu3Sn (b, d) |
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