基于飞秒激光时域热反射法的微尺度Cu-Sn金属间化合物热导率研究
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Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System
ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei
图4 Cu3Sn晶粒取向分布情况
Fig.4 Orientation distributions of Cu3Sngrains
(a) band contrast image (b) Euler color image
(c) orientation color image perpendicular to RD-TD plane
(d) (001) pole figure (e) (100) pole figure (f) (301) pole figure