基于飞秒激光时域热反射法的微尺度Cu-Sn金属间化合物热导率研究 |
周丽君, 位松, 郭敬东, 孙方远, 王新伟, 唐大伟 |
Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System |
ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei |
图3 Cu6Sn5晶粒取向分布情况 |
Fig.3 Orientation distributions of Cu6Sn5 grains (a) band contrast image (b) Euler color image (?1, Φ, ?2—Euler angles) (c) orientation color image perpendicular to RD-TD plane (RD—rolling direction, TD—transverse direction) (d) (001) pole figure (e) (100) pole figure (f) (301) pole figure |
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