基于飞秒激光时域热反射法的微尺度Cu-Sn金属间化合物热导率研究

周丽君, 位松, 郭敬东, 孙方远, 王新伟, 唐大伟

Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System

ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei

图2 Cu-Sn扩散偶界面处微观结构的SEM像、EDS分析及XRD谱

Fig.2 Microstructure analyses of the interface for Cu-Sn diffusion couple specimens (a) SEM image of microstructure (b) EDS element maps of square region in Fig.2a (c) XRD spectrum of Cu-Sn specimen