突破强度-导电率制约关系:晶粒异构设计 |
| 侯嘉鹏, 孙朋飞, 王强, 张振军, 张哲峰 |
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Breaking the Trade-Off Relation Between Strength and Electrical Conductivity: Heterogeneous Grain Design |
| HOU Jiapeng, SUN Pengfei, WANG Qiang, ZHANG Zhenjun, ZHANG Zhefeng |
| 图3 不同拉拔变形量工业纯Cu线径向和轴向TEM像 |
| Fig.3 TEM images of the radial sections (a-c) and the axial sections (d-f) of the commercially pure Cu wires with ε = 0 (a, d), ε = 42.7% (b, e), and ε = 79.7% (c, f) |
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