基于增强相构型设计的石墨烯/Cu复合材料研究进展
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赵乃勤, 郭斯源, 张翔, 何春年, 师春生
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Progress on Graphene/Copper Composites Focusing on Reinforcement Configuration Design: A Review
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ZHAO Naiqin, GUO Siyuan, ZHANG Xiang, HE Chunnian, SHI Chunsheng
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表2 不同分布构型石墨烯/Cu复合材料电导率[38,42,43,48,59~62]
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Table 2 The conductivities of graphene/Cu composites with different configurations[38,42,43,48,59-62]
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Distribution configuration | Preparation method | Electrical conductivity %IACS | Ref. |
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Homogenous distribution | Mechanical milling + HPS | 94 | [60] | | Ultrasound assisted electroplating | 44 | [61] | | In situ grown Mo2C@GNPs + HPS + rolling | 93 | [48] | Network distribution | In situ grown 3D Gr network + HPS + rolling | 103 | [42] | | In situ grown 3D Gr network + rolling + sintering | 98 | [43] | Laminate distribution | In situ grown Gr + flaky powder metallurgy + HPS | 97.1 | [38] | | Impregnation reduction + SPS | 90 | [62] | | In situ grown Gr + HPS | 117 | [59] |
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