颗粒尺寸对金刚石/Al封装基板热物性的影响

周洪宇, 冉珉瑞, 李亚强, 张卫冬, 刘俊友, 郑文跃

Effect of Diamond Particle Size on the Thermal Properties of Diamond/Al Composites for Packaging Substrate

ZHOU Hongyu, RAN Minrui, LI Yaqiang, ZHANG Weidong, LIU Junyou, ZHENG Wenyue

图5 金刚石/Al复合材料界面处的SEM像及EPMA元素分布

Fig.5 SEM image (a) and EPMA map of element distribution at the diamond/Al composite interface (along the line in Fig.5a) (b) (Diamond particle size is 106 μm)